Internet Explorer, Chrome Browser, Firefox Browser, Safari Browser
Press Release24 June 2025Digital IndustriesSan Francisco, USA
Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs
Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs
Siemens’ new Innovator3D IC™ solution suite
enables IC designers to efficiently author, simulate and manage heterogeneously
integrated 2.5D/3D IC designs. In addition, Siemens’ new Calibre 3DStress
software leverages advanced thermo-mechanical analysis to identify the
electrical impact of stress at the transistor level. Together, these solutions
dramatically reduce risk and enhance the design, yield and reliability of
complex, next generation 2.5D/3D IC designs.
“By delivering a stress-aware multiphysics
analysis solution powered by Calibre 3DStress and driven by the Innovator3D IC
solution suite, Siemens enables customers to overcome the complexities and
risks associated with 3D IC designs,” said Mike Ellow, CEO, Siemens EDA,
Siemens Digital Industries Software. “These capabilities are critical for our
customers, allowing them to accelerate productivity and meet stringent design
timelines by effectively eliminating the barriers of design complexity that
traditionally impact design cycles.”
Innovator3D IC solution suite
Siemens’ new Innovator3D IC solution suite delivers a fast, predictable path for planning and heterogeneous integration, substrate/interposer implementation, interface protocol analysis compliance and data management of designs and design data IP.
Built on an AI-infused user experience
offering extensive multithreading and multicore capabilities to achieve optimal
capacity and performance on 5+ million pin designs, the new Innovator3D IC
solution suite is comprised of the Innovator3D IC Integrator, a consolidated
cockpit for constructing a digital twin using a unified data model for design
planning, prototyping and predictive analysis; the Innovator3D IC Layout
solution for correct-by-construction package interposer and substrate
implementation; the Innovator3D IC Protocol Analyzer for chiplet-to-chiplet and
die-to-die interface compliance analysis; and the Innovator3D IC Data
Management solution, for the work-in-progress management of designs and design
data IP.
Calibre 3DStress
With the thinner dies and higher package
processing temperatures of 2.5D/3D IC architectures,
IC designers have discovered that designs validated and tested at the die level
often no longer conform to specifications after packaging reflows.
Engineered to address this challenge,
Calibre 3DStress supports accurate, transistor-level analysis, verification,
and debugging of thermo-mechanical stresses and warpage in the context of 3D IC
packaging, allowing chip designers to evaluate how chip-package interaction
will affect the functionality of their designs earlier in the development
cycle. This foresight not only prevents future failures but also optimizes the
design for better performance and durability.
Building on the launch of Calibre 3DThermal in 2024, Calibre 3DStress expands the Multiphysics solution, dramatically reducing thermo-mechanical impacts, and delivering design and electrical behavior visibility earlier in the design process. Unlike package-level stress analysis tools, Calibre 3DStress uniquely detects transistor level stress to verify that neither packaging processes nor product functionalities will compromise circuit level performance.
Calibre 3DStress represents an
important part of Siemens’ 3D IC multi-physics software portfolio and a
foundational part of Siemens’ IC digital twin and semiconductor development
workflows. It delivers an innovative combination of industry-standard Calibre
physical verification functionality with a native and highly advanced
mechanical solver to evaluate stresses in IC structures and materials.
Customer experiences with Siemens’ technologies for 3D IC design
“In 2023, we adopted Siemens’ technology to
meet the complex design and integration challenges of our advanced platform
solutions. The Innovator3D IC solution suite plays a critical role in enabling
the high-performance solutions we deliver to AI and HPC datacenters,” said
Bryan Black, CEO of Chipletz, a leading fabless AI platform provider.
“Siemens EDA’s Calibre 3DStress tool can
synthesize the complexity of components, materials and processes related to 3D
IC architectures and can create accurate IP-level stress analysis. Using it, ST
has been able to implement early design planning and sign-off flows, and
accurately model potential electrical failures due to IP-level stress within a
3D IC package. The result is improved reliability and quality, together with a
reduced time to market, which provide a win both for ST and our customers,”
said Sandro Dalle Feste, APMS Central R&D Senior Director,
STMicroelectronics.
To learn more about Siemens’ broad portfolio
of solutions for 2.5D/3D
IC architectures, visit https://eda.sw.siemens.com/en-US/ic-packaging/3d-ic-design/
Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.
For this press release
Follow us on X
Siemens Digital Industries (DI) empowers companies of all sizes within the process and discrete manufacturing industries to accelerate their digital and sustainability transformation across the entire value chain. Siemens’ cutting-edge automation and software portfolio revolutionizes the design, realization and optimization of products and production. And with Siemens Xcelerator – the open digital business platform – this process is made even easier, faster, and scalable. Together with our partners and ecosystem, Siemens Digital Industries enables customers to become a sustainable Digital Enterprise. Siemens Digital Industries has a workforce of around 70,000 people worldwide.
Siemens AG (Berlin and Munich) is a leading technology company focused on industry, infrastructure, mobility, and healthcare. The company’s purpose is to create technology to transform the everyday, for everyone. By combining the real and the digital worlds, Siemens empowers customers to accelerate their digital and sustainability transformations, making factories more efficient, cities more livable, and transportation more sustainable. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a leading global medical technology provider pioneering breakthroughs in healthcare. For everyone. Everywhere. Sustainably.
In fiscal 2024, which ended on September 30, 2024, the Siemens Group generated revenue of €75.9 billion and net income of €9.0 billion. As of September 30, 2024, the company employed around 312,000 people worldwide on the basis of continuing operations. Further information is available on the Internet at www.siemens.com.
Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.