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Siemens and Foxconn team up to optimize forward-thinking manufacturing
Siemens and Foxconn sign memorandum of understanding (MoU) highlighting joint commitment to sustainability
Cooperation to define standards for the factory of the future and manufacturing processes
Innovations to positively impact information and communications technology and electric vehicle production ecosystems
Siemens Xcelerator portfolio to optimize Foxconn's operations for efficiency and agility
Siemens AG, a leading
technology company, and Hon Hai Technology Group (Foxconn), the
world's largest electronics manufacturer, have signed a memorandum of
understanding (MoU) to drive digital transformation and sustainability in smart
manufacturing platforms.
Siemens and Foxconn sign memorandum of understanding (MoU) highlighting joint commitment to sustainability
Cooperation to define standards for the factory of the future and manufacturing processes
Innovations to positively impact information and communications technology and electric vehicle production ecosystems
Siemens Xcelerator portfolio to optimize Foxconn's operations for efficiency and agility
Siemens AG, a leading
technology company, and Hon Hai Technology Group (Foxconn), the
world's largest electronics manufacturer, have signed a memorandum of
understanding (MoU) to drive digital transformation and sustainability in smart
manufacturing platforms.
Young Liu, Chairman and CEO of Hon Hai Technology
Group (Foxconn) and Cedrik Neike, CEO of Digital Industries and Member of the
Managing Board of Siemens AG signing MoU.
The collaboration focuses on
global manufacturing processes in electronics, information and communications
technology, and electric vehicles (EV). Siemens and Foxconn are working
together to establish a scalable and seamless engineering and manufacturing
ecosystem.
Roland Busch, President and CEO of
Siemens AG emphasized the significance of this partnership:
"We believe in the power of ecosystems to drive digital and sustainability
transformation and scale technology. Our partnership underscores our commitment
to shape the future of electronics manufacturing. We will support customers
with greater efficiency and speed due to optimized engineering and
manufacturing workflows.”
Young Liu, Chairman and CEO
of Hon Hai Technology Group (Foxconn) said: “Foxconn is transforming into a
platform solutions provider for smart manufacturing, smart EV, and smart city.
Joining forces with Siemens accelerates our digital transformation journey and
opens up new possibilities for innovation and sustainability."
This MoU identifies key
collaboration areas to increase the level of automation within Foxconn's facilities.
These areas include electronics manufacturing services (EMS) and contract
design and manufacturing service (CDMS), which is Foxconn’s innovative business
model for electric vehicles. Both companies will explore initiatives to work
towards the factory of the future by implementing Siemens' leading factory
automation portfolio and industrial software, including building blocks such as
digital twin technology and artificial intelligence (AI). Siemens Xcelerator,
with its comprehensive suite of software and solutions, will play a pivotal
role in optimizing Foxconn's engineering and manufacturing workflows,
facilitating efficiency and agility across its operations.
The collaboration aims to leverage how Siemens' technical expertise can enhance
Foxconn’s sustainability performance, contributing to energy savings and
reduced CO2 footprint. This partnership involves establishing transparent
monitoring processes and applying professional services and digital solutions,
as both companies work towards a greener future for electronics manufacturing.
“Electronics are the backbone of modern society,
powering consumer goods to EVs and e-mobility solutions. Therefore, we
are very proud to intensify our collaboration with Foxconn”, said Cedrik Neike,
CEO of Digital Industries and Member of the Managing Board of Siemens AG. “With
Siemens’ domain know-how and leading portfolio in factory automation and
software, we will accelerate the transformation of the electronics
manufacturing industry and support Foxconn to achieve its
sustainability targets.”
Dr. Zhe Shi, Foxconn’s
Chief Digital Officer and head of its Smart Manufacturing platform, added:
“Siemens is a leader in providing digital transformation solutions. Our
deepening collaboration to build the ‘factory of the future’ in the AI era will
enable us to provide topflight manufacturing service to all our customers.”
(from left) Cedrik Neike, CEO of Digital Industries and Member of
the Managing Board of Siemens AG, Young Liu, Chairman and CEO of Hon Hai
Technology Group (Foxconn) and Roland Busch, CEO of
Siemens AG at the signing ceremony of the MoU.
Siemens AG (Berlin and Munich) is a leading technology company focused on industry, infrastructure, transport, and healthcare. From more resource-efficient factories, resilient supply chains, and smarter buildings and grids, to cleaner and more comfortable transportation as well as advanced healthcare, the company creates technology with purpose adding real value for customers. By combining the real and the digital worlds, Siemens empowers its customers to transform their industries and markets, helping them to transform the everyday for billions of people. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a globally leading medical technology provider shaping the future of healthcare.
In fiscal 2023, which ended on September 30, 2023, the Siemens Group generated revenue of €77.8 billion and net income of €8.5 billion. As of September 30, 2023, the company employed around 320,000 people worldwide. Further information is available on the Internet at www.siemens.com.
Foxconn
Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com