Keys to the expanded Veloce hardware-assisted verification system
Innovation in chip, system, and software design enables Veloce Strato+ to deliver to the capacity roadmap published in 2017 when the Veloce Strato platform was introduced. The innovative design and manufacturing of the Crystal 3+— a new, proprietary 2.5D chip -- increases system capacity by 1.5x over the previous Veloce Strato system. This innovation enables Veloce Strato+ to lead in the emulation market with marketing-leading available capacity of 15B gates. This capacity, which is the largest effective capacity available today, is now in use at multiple Veloce Strato+ customers.
“AMD utilizes Veloce Emulation platforms as part of our pre-silicon verification and validation solutions,” said Alex Starr, corporate fellow, Methodology Architect, AMD “The high-performance designs we create demand scalable, dependable and innovative emulation solutions. We are delighted to have worked with Siemens to pioneer high-capacity Veloce Strato+ system deployment at AMD. Furthermore, we’re excited to see 2nd and 3rd Gen AMD EPYC™ processors qualified for use with Veloce Strato and Veloce Strato+ platforms. The high-performance capabilities of both families of processors bring new levels of productivity to the Veloce ecosystem and its customers, like AMD.”
The Veloce Strato system is also expanding the list of qualified processors by adding the AMD EPYC™ 7003 series processor, starting today. These new processors are fully qualified to run with the Veloce Strato systems as run time hosts and co-model hosts.
Veloce Primo and Veloce proFPGA represent the industry’s most powerful and versatile approach to FPGA prototyping. The enterprise-level FPGA prototyping system, Veloce Primo, simultaneously delivers outstanding performance, with capacity scaling up to 320 FPGAs and a consistent working model with Veloce Strato in terms of software workloads, design models and front-end compilation technology. This fundamental alignment between emulation and prototyping contributes to reducing the cost of verification by leveraging the right tool for the task where the emulation and the prototyping work together as complimentary solutions for a better outcome in the shortest cycle. Veloce Primo also supports both virtual (emulation offload) and in-circuit-emulation (ICE) use models for highest possible performance while maintaining accurate clock ratios in both modes.
“The increasing demand for computing in all industries means time to market is critical,” said Tran Nguyen, senior director of design services, Arm. “The Veloce Primo enterprise FPGA prototyping solution from Siemens helps Arm quickly resolve design issues and achieve verification objectives so that our ecosystem can deliver quality Arm-based SoCs to support the rapid pace of innovation.”
“We are delighted to welcome Siemens EDA to the FPGA prototyping market with their launch of Veloce Primo,“ said Hanneke Krekels, senior director, Core Vertical Markets, at Xilinx. “Xilinx has a long-standing relationship with Siemens both as a customer and as a collaboration partner, and we’re excited to provide our recent and industry-leading Virtex UltraScale+ VU19P device enabling scalability and capacity to this new product offering “
Veloce proFPGA brings a proven, world-class desktop platform to the Veloce hardware-assisted verification system (via an OEM agreement with Pro Design). With a modular approach to capacity, the Veloce proFPGA family of products delivers scalability across a range of capacity requirements – from 40M gates to 800M gates – based on high-end FPGAs including Intel Stratix 10 GX 10M and Virtex UltraScale+ VU19P device.
“The advanced technology found in the proFPGA family delivers many advantages for validating today’s AI/ML, 5G, and data center ASIC designs,” said Gunnar Scholl, CEO of Pro Design. “We are excited to partner with Siemens EDA. Our collective experience, insight and strategy for the FPGA desktop prototyping market is being recognized, and we are excited to accelerate market penetration in this space through the collaboration with Siemens.”