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Press Release26 September 2022Digital IndustriesPlano,
Texas, USA
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi-die solution
Siemens Digital Industries Software introduced the Tessent™ Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
As demand for smaller, more power efficient and higher
performing ICs continues to challenge the global IC design community,
next-generation devices increasingly feature complex 2.5D and 3D architectures
that connect dies vertically (3D IC) or side-by-side (2.5D) so that they behave
as a single device. However, these approaches can present significant
challenges for IC test, since most legacy IC test approaches are based on conventional
two-dimensional processes.
To address these challenges, Siemens today introduces Tessent
Multi-die software -- the industry’s most comprehensive DFT automation solution
for highly complex DFT tasks associated with 2.5D and 3D IC designs. The new
solution works seamlessly with Siemens’ Tessent™ TestKompress™ Streaming Scan Network software
and Tessent™ IJTAG software, which optimize DFT test resources for each block
without concern for impacts to the rest of the design, thereby streamlining DFT
planning and implementation for the 2.5D and 3D IC era. Using Tessent Multi-die
software, IC design teams can rapidly generate IEEE 1838 compliant hardware
featuring 2.5D and 3D IC architectures.
“IC design organizations are seeing dramatic spikes in
IC test complexity due to the rapid adoption and deployment of designs featuring
densely packed dies in 2.5D and 3D devices,” said Ankur Gupta, vice president
and general manager of the Tessent business unit for Siemens Digital Industries
Software. “With Siemens’ new Tessent Multi-die solution, our customers can be
ready for the designs of tomorrow, while slashing test implementation effort
and simultaneously optimizing manufacturing test cost today.”
In addition to supporting comprehensive test for 2.5D
and 3D IC designs, the Tessent Multi-die solution can generate die-to-die
interconnect patterns and enable package level test using the Boundary Scan
Description Language (BSDL). Further, Tessent Multi-die supports integration of
flexible parallel port (FPP) technology by leveraging the packetized data
delivery capabilities of Siemens’ Tessent TestKompress Streaming Scan Network
software. Introduced two years ago, Tessent TestKompress Streaming Scan Network
decouples core-level DFT requirements from the chip-level test delivery
resources. This enables a no-compromise, bottom-up DFT flow that can
dramatically simplify DFT planning and implementation, while reducing test time
up to 4X.
“As
the limits of traditional 2D IC design approaches become increasingly clear
over time, more design teams are leveraging the power, performance and form
factor advantages that 2.5D and 3D IC architectures can deliver. But deploying these advanced schemes in new
design starts without first establishing a DFT strategy that acknowledges the
inherent challenges these architectures present can raise costs and undermine
aggressive timelines,” said Laurie Balch, president and research director for
Pedestal Research. “However, by evolving DFT technology to keep pace with the
rapid adoption of multi-dimensional designs, EDA vendors can play a key role in
further enabling global, mainstream adoption of 2.5D and 3D architectures.”
For
more information on Siemens’ new Tessent Multi-die solution, please visit
https://eda.sw.siemens.com/en-US/ic/tessent/test/multi-die/
https://eda.sw.siemens.com/en-US/ic/tessent/test/multi-die/
Siemens Digital Industries Software is driving transformation to enable a digital enterprise where
engineering, manufacturing and electronics design meet tomorrow. The
Siemens Xcelerator portfolio helps companies of all sizes create and leverage digital twins
that provide organizations with new insights, opportunities and levels of
automation to drive innovation. For more information on Siemens Digital Industries
Software products and services, visit
siemens.com/software
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Siemens Digital Industries (DI) is an innovation leader in automation and digitalization. Closely collaborating with partners and customers, DI drives the digital transformation in the process and discrete industries. With its Digital Enterprise portfolio, DI provides companies of all sizes with an end-to-end set of products, solutions and services to integrate and digitalize the entire value chain. Optimized for the specific needs of each industry, DI’s unique portfolio supports customers to achieve greater productivity and flexibility. DI is constantly adding innovations to its portfolio to integrate cutting-edge future technologies. Siemens Digital Industries has its global headquarters in Nuremberg, Germany, and has around 76,000 employees internationally.
Siemens AG (Berlin and Munich) is a technology company focused on industry, infrastructure, transport, and healthcare. From more resource-efficient factories, resilient supply chains, and smarter buildings and grids, to cleaner and more comfortable transportation as well as advanced healthcare, the company creates technology with purpose adding real value for customers. By combining the real and the digital worlds, Siemens empowers its customers to transform their industries and markets, helping them to transform the everyday for billions of people. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a globally leading medical technology provider shaping the future of healthcare. In addition, Siemens holds a minority stake in Siemens Energy, a global leader in the transmission and generation of electrical power.
In fiscal 2021, which ended on September 30, 2021, the Siemens Group generated revenue of €62.3 billion and net income of €6.7 billion. As of September 30, 2021, the company had around 303,000 employees worldwide. Further information is available on the
www.siemens.com.