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Press Release04 December 2023Intel/SiemensSanta Clara/Munich
Siemens and Intel to collaborate on advanced semiconductor manufacturing
Siemens and Intel to collaborate to advance semiconductor manufacturing production efficiency and sustainability across scopes 1-3 of the value chain
Semiconductors are crucial for the global economy and for lowering carbon footprints across economies by enabling sustainable solutions
Intel and Siemens will leverage their respective portfolios of cutting edge IoT solutions, along with Siemens automation solutions to enhance semiconductor manufacturing efficiency and sustainability
Siemens
AG, a leading technology company, and Intel Corporation, one of the world’s
largest semiconductor companies, have signed a Memorandum of Understanding
(MoU) to collaborate on driving digitalization and sustainability of
microelectronics manufacturing. The companies will focus on advancing future
manufacturing efforts, evolving factory operations and cybersecurity, and supporting
a resilient global industry ecosystem.
Siemens and Intel to collaborate to advance semiconductor manufacturing production efficiency and sustainability across scopes 1-3 of the value chain
Semiconductors are crucial for the global economy and for lowering carbon footprints across economies by enabling sustainable solutions
Intel and Siemens will leverage their respective portfolios of cutting edge IoT solutions, along with Siemens automation solutions to enhance semiconductor manufacturing efficiency and sustainability
Siemens
AG, a leading technology company, and Intel Corporation, one of the world’s
largest semiconductor companies, have signed a Memorandum of Understanding
(MoU) to collaborate on driving digitalization and sustainability of
microelectronics manufacturing. The companies will focus on advancing future
manufacturing efforts, evolving factory operations and cybersecurity, and supporting
a resilient global industry ecosystem.
Cedrik Neike, CEO of Digital Industries and board member for Siemens AG and Keyvan Esfarjani, chief global operations officer for Intel Corp. pose for a photo to mark the signing of a memorandum of understanding by the companies to advance global manufacturing efforts. The deal was signed in Santa Clara, CA, in December 2023
“Semiconductors
are the lifeblood of our modern economies. Few things run without chips. Therefore,
we’re proud to collaborate with Intel to quickly advance semiconductor production.
Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware
and software and electrical equipment to this collaboration,” said Cedrik
Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG.
“Our joint efforts will contribute to achieving global sustainability goals.”
The
MoU identifies key areas of collaboration to explore a variety of initiatives,
including optimizing energy management and addressing carbon footprints across
the value chain. For instance, the collaboration will explore use of “digital twins”
of complex, highly capital-intensive manufacturing facilities to standardize
solutions where every percentage of efficiency gained is meaningful.
The
collaboration will also explore minimizing energy use through advanced modeling
of natural resources and environmental footprints across the value chain.
To
gain more information on product-related emissions, Intel will explore product
and supply chain related modeling solutions with Siemens that drive data-based
insights and help the industry accelerate progress in reducing its collective
footprint.
“The world needs a more globally
balanced, sustainable and resilient semiconductor supply chain to meet the
increasing demand for chips,” said Keyvan Esfarjani, Intel Executive Vice
President and Chief Global Operations Officer. “We are excited to build upon
Intel’s advanced manufacturing capabilities by expanding our collaboration with
Siemens to explore new areas where we can utilize Siemens’ portfolio of
automation solutions to enhance efficiency and sustainability in semiconductor
infrastructure, facilities, and factory operations. This MOU will benefit
regional and global industry value chains.”
Siemens and Intel Forge Pioneering Partnership for Next Generation Microelectronics Manufacturing
Efficiency and sustainability in the semiconductor industry to be increased
Sustainable
practices across the entire semiconductor lifecycle, including design,
manufacturing, operation, efficiency, and recycling, are critical for meeting
growing demand for powerful, sustainable chips. Technology has the power to
accelerate solutions to reduce computing-related climate impacts across the
technology industry and the rest of the global economy. Automation and
digitalization hold the key to addressing the challenges as the industry drives
toward net-zero greenhouse gas emissions. By combining their strengths and
expertise, Siemens and Intel are poised to lead the way in driving positive
change.
Siemens AG (Berlin and Munich) is a leading technology company focused on industry, infrastructure, transport, and healthcare. From more resource-efficient factories, resilient supply chains, and smarter buildings and grids, to cleaner and more comfortable transportation as well as advanced healthcare, the company creates technology with purpose adding real value for customers. By combining the real and the digital worlds, Siemens empowers its customers to transform their industries and markets, helping them to transform the everyday for billions of people. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a globally leading medical technology provider shaping the future of healthcare.
In fiscal 2023, which ended on September 30, 2023, the Siemens Group generated revenue of €77.8 billion and net income of €8.5 billion. As of September 30, 2023, the company employed around 320,000 people worldwide. Further information is available on the Internet at www.siemens.com.